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AIM RMA 212 is a highly active resin/rosin-based formulation designed specifically to have excellent tack time and very good soldering characteristics. 212 has a wide process window uncommon to most solder pastes, in addition to a good activity level, which allows the product to accommodate a variety of environments and process applications.
212 performs well in continuous production, offering good slump resistance, high tack, excellent wetting, and low post-process residues. 212 has been utilized on various assemblies with RF designs without cleaning; however, the compatibility of flux residues on RF assemblies is strongly dependent upon circuitry design.
The flux classification for this product is ROL0.
Technical Data Sheet