Eco‐Stencil™ SMT Stencil Cleaner, 1-Gal Container

Techspray Renew Eco-Stencil™ SMT Stencil Cleaner – Low VOC, Nonflammable Solder Paste & Adhesive Cleaner

High-Performance SMT Stencil Cleaner for Solder Paste & Uncured Adhesive Removal

Techspray Renew Eco-Stencil™ SMT Stencil Cleaner (Product 1570) is a high-performance cleaning solution formulated to effectively remove water-based, RMA, no-clean, lead-free, and other solder pastes, as well as uncured adhesives. It is designed for cleaning SMT stencils, screens, squeegees, misprinted circuit boards, tools, work surfaces, and equipment. 

Eco-Stencil™ provides an effective alternative to IPA-based cleaners while offering a nonflammable, low-VOC, non-ozone-depleting, and halide-free formulation. The halide-free chemistry helps prevent ionic contamination, making it well suited for electronics manufacturing and PCB assembly operations.

Key Features & Benefits

• Effective Solder Paste Removal: Quickly cleans water-based, RMA, no-clean, lead-free, and other solder paste formulations
• Removes Uncured Adhesives: Suitable for cleaning uncured adhesive residues; soaking may be required
• Safe for SMT Equipment: Designed for stencils, squeegees, tools, misprinted boards, and equipment surfaces
• Nonflammable: No flash point to boiling point and does not sustain combustion
• Low VOC: Contains only 2.7% VOC by weight (26.5 g/L)
• Non-Ozone Depleting: Formulated with environmental considerations in mind
• Halide-Free: Helps prevent ionic contamination
• Water Miscible: Fully miscible in water
• IPA Alternative: Designed as an alternative where IPA use may be restricted due to VOC, safety, or waste-disposal requirements

Applications

• Manual SMT stencil cleaning
• Automatic underside wipe stencil cleaning
• Squeegee, tool, and work surface cleaning
• Cleaning misprinted circuit boards
• Removal of unsoldered leaded and lead-free solder pastes
• Removal of uncured adhesives

Chemical & Physical Properties

• Physical State: Liquid
• Appearance: Clear, mobile liquid
• Odor: Faint ethereal odor
• pH: 5–6
• Percent Volatile: 97% at 104°C
• Vapor Pressure: <0.01 mmHg at 20°C (VOC composite vapor pressure)
• Boiling Point: Approximately 212°F (100°C)
• Flash Point: None to boiling point; does not sustain combustion
• Solubility in Water: Fully miscible
• Density: 0.99 at 25°C
• VOC: 2.7% by weight, 26.5 g/L
• Shelf Life: 5 years unopened; 2 years opened

Material Compatibility

• Brass Foil: Excellent
• Copper Foil: Excellent
• Nickel 200: Excellent
• Aluminum 6061: Excellent
• Aluminum 2024: Excellent
• Anodized Aluminum: Good
• Stainless Steel 316: Excellent
• Stainless Steel 304: Excellent
• Galvanized Steel: Excellent
• Mild Carbon Steel: Not recommended for prolonged exposure

The compatibility results are based on a 30-day submersion test in a sealed container. Because Eco-Stencil™ is water-based, prolonged exposure can encourage oxidation of iron, steel, and other susceptible metals.

Specifications

• Brand: Techspray
• Product Line: Renew Eco-Stencil™
• Product: SMT Stencil Cleaner
• Product Number: 1570
• Cleaner Type: Water-based SMT stencil and electronics cleaner
• Primary Use: Solder paste and uncured adhesive removal
• Flammability: Nonflammable
• VOC Content: 2.7% by weight (26.5 g/L)
• Halides: Halide-free
• Water Solubility: Fully miscible
• pH: 5–6
• Density: 0.99 at 25°C
• Boiling Point: Approx. 212°F (100°C)
• Shelf Life: 5 years unopened / 2 years opened
• CARB: Compliant
• REACH / WEEE: Compliant with stated initiatives
• RoHS Restricted Substances: None stated
• SVHC Listed Substances: None stated