AIM WS488-SN63/PB37-T4 Water Soluble Solder Paste, 500 Gram Jar

The  AIM WS488-SN63/PB37-T4 Water Soluble Solder Paste is a top-quality, leaded solder paste engineered for reliable performance in high-volume and precision electronic manufacturing. Designed with AIM’s advanced flux chemistry, this solder paste delivers excellent wetting, printability, and residue removal — ideal for applications demanding consistency and residue-free solder joints.

AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes.

After reflow, WS488 post-reflow residues are easily cleaned with DI water, especially under low-standoff devices. This simplifies the cleaning process and helps maintain a high level of reliability in the final assembly.

WS488 is available with T4 powder, but it is also compatible with finer powders, making it suitable for both print and dispense applications. Additionally, WS488 solder paste is readily available in SAC305 and Sn63/Pb37 alloys, with the possibility of other alloys upon request.

Features:

• High activity
• 8+ hour stencil life
• Easy to clean residues with DI water
• Residues MUST be removed
• Type 4 lead-free and leaded alloys
• Extended cleaning window
• Superior slump resistance

Please review our Solder Paste Shipping Recommendations before you place your order.

Technical Data Sheet
SDS