AIM WS483-SN63/PB37-T4 Water Soluble Solder Paste, 250 Gram Jar

AIM WS483 Solder Paste is a Halide-free, water-soluble solder paste designed for high-reliability SMT assembly using Sn63/Pb37 eutectic alloy.

Product Features:

• Humidity & Heat Resistant: Maintains performance in challenging environments.
• High Tack & Slump Resistance: Ensures consistent stencil printing results.
• Extended Cleaning Window: Allows flexible post-reflow cleaning with minimal residue concerns.
• Non-Foaming Residue: Optimized for use with high-pressure aqueous cleaning systems.
• Eutectic Alloy: Sn63/Pb37 provides a sharp melting point at 183°C for reliable reflow.
• Halide-Free Chemistry: Promotes environmental and equipment safety.

Product Specifications:

• Brand: AIM Solder
• Part Number: WS483-SN63/PB37-T4
• Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead)
• Flux Type: Water Soluble
• Powder Size: T4 (20–38 microns)
• Flux Content: Approximately 11.5%
• Package: 250 gram (8.8 oz) jar
• Lead-Free: No
• RoHS Compliant: No

Ideal For:

• Standard and fine-pitch SMT assembly
• Automotive, consumer, industrial, and medical electronics
• High-volume PCB manufacturing
• Environments requiring water-soluble flux systems

Documentation:

• Technical Data Sheet (PDF)
• Safety Data Sheet – US English (PDF)

Cold Shipping Required

Important: This product must be shipped cold to preserve performance and stability. Next Day shipping is strongly recommended to maintain material integrity during transit.

Fast Shipping | In Stock

Orders placed before 2 PM (Pacific Time) ship the same day. Each jar is cold-packed with thermal protection for safe, compliant delivery.

Why Choose AIM WS483?

AIM’s WS483 solder paste is engineered for robust reliability in demanding SMT production. Its stable performance, low residue, and water-soluble properties make it a trusted solution for high-volume electronics manufacturing.

Secure your material today — order with Next Day shipping for optimal cold chain handling!