AIM Solder Products
AIM SN63/PB37 WS482 3% Water Soluble Core Wire Solder .015" Diameter
AIM SN63/PB37 WS482 3% Water Soluble Core Wire Solder .015" Diameter
SKU:SMT 14215
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AIM SN63/Pb37 WS482 3% Water-Soluble Core Wire Solder – .015" Diameter
High-Precision Halide-Free Water-Soluble Solder for Professional Electronics Assembly
The AIM SN63/Pb37 WS482 3% Water-Soluble Core Wire Solder provides reliable, high-quality solder joints for fine-pitch surface mount devices (SMD), printed circuit boards (PCBs), and other precision electronics applications. Its .015" diameter wire ensures precise control for delicate soldering tasks, producing strong and consistent connections.
Product Overview
This solder wire features the 63/37 tin-lead eutectic alloy (Sn63/Pb37) combined with WS482 3% halide-free water-soluble flux core. The halide-free flux promotes excellent wetting, smooth flow, and rapid soldering while leaving residues that are fully removable with water, ensuring clean, non-corrosive solder joints suitable for high-reliability applications.
Key Features & Benefits
- .015" Diameter – Ideal for fine-pitch soldering and high-density PCBs.
- 63/37 Eutectic Alloy – Smooth melting and solidification for reliable solder joints.
- WS482 3% Halide-Free Water-Soluble Flux – Residues are fully water-soluble and non-corrosive, leaving a clean finish safe for sensitive electronics.
- Excellent Wetting and Flow – Ensures consistent electrical and mechanical connections.
- Compatible with Manual and Automated Soldering – Works for hand soldering, reflow, and robotic processes.
- Reduces Spatter – Cleaner solder joints and minimal material waste.
Applications
- Fine-Pitch Surface Mount Device (SMD) Assembly
- PCB Repair and Rework
- High-Density Electronics Assembly
- Precision and High-Reliability Electronics Manufacturing
Cleaning Instructions
The WS482 3% halide-free water-soluble flux leaves residues that are fully removable with water, ensuring clean solder joints and preventing corrosion. Ideal for high-reliability and sensitive electronic assemblies.
Technical Specifications
- Alloy: Sn63/Pb37 (Eutectic)
- Flux Type: WS482 3% Halide-Free Water-Soluble Core
- Wire Diameter: 0.015" (0.38 mm)
- Melting Point: 183°C (361°F)
- Flux Residue: Fully water-soluble and non-corrosive
- IPC Classification: ORM0 (per IPC J-STD-004)
- Compatibility: Manual soldering, reflow, and automated soldering processes
Why Choose AIM SN63/Pb37 WS482?
The combination of eutectic alloy and halide-free WS482 flux ensures fast wetting, strong joints, and fully cleanable residues. Perfect for fine-pitch electronics, PCB repair, and high-reliability assemblies requiring water-cleaned solder joints.
Choose AIM SN63/Pb37 WS482 3% Halide-Free Water-Soluble Wire Solder for precise, reliable, and clean soldering on high-density and fine-pitch electronic assemblies.
Unit: 1/2 lb. spool
