AIM SN63/PB37 OAJ 2% Water Soluble Core Wire Solder .062" Diameter

AIM SN63/Pb37 OAJ 2% Water-Soluble Core Wire Solder – .062" Diameter

High-Performance Water-Soluble Solder for Electronics Assembly

The AIM SN63/Pb37 OAJ 2% Water-Soluble Core Wire Solder delivers reliable, high-quality solder joints for through-hole components, medium- to large-pitch surface mount devices (SMD), and printed circuit boards (PCBs). Its .062" diameter wire ensures consistent soldering and strong mechanical and electrical connections, ideal for professional electronics assembly.

Product Overview

This solder combines the classic 63/37 tin-lead eutectic alloy (Sn63/Pb37) with OAJ 2% water-soluble flux core. The water-soluble flux improves wetting, promotes smooth flow, and reduces spatter while leaving residues that are fully removable with water. This ensures clean, non-corrosive solder joints suitable for high-reliability applications.

Key Features & Benefits

• .062" Diameter – Suitable for through-hole and large-pitch soldering applications.
• 63/37 Eutectic Alloy – Smooth melting and solidification for strong, reliable joints.
• OAJ 2% Water-Soluble Flux – Residues are fully water-soluble, leaving a clean, non-corrosive finish.
• Excellent Wetting and Flow – Produces consistent mechanical and electrical connections.
• Compatible with Manual and Automated Soldering – Ideal for hand soldering, reflow, and robotic processes.
• Reduced Spatter – Cleaner joints and less material waste.

Applications

• Through-Hole & SMT Component Assembly
• Medium- and High-Density PCB Soldering
• PCB Repair and Rework
• Industrial and Professional Electronics Manufacturing

Cleaning Instructions

The OAJ 2% water-soluble flux leaves residues that are fully removable with water, ensuring clean solder joints and preventing corrosion. Perfect for high-reliability and sensitive electronic assemblies.

Technical Specifications

• Alloy: Sn63/Pb37 (Eutectic)
• Flux Type: OAJ 2% Water-Soluble Core
• Wire Diameter: 0.062" (1.57 mm)
• Melting Point: 183°C (361°F)
• Flux Residue: Fully water-soluble and non-corrosive
• Compatibility: Manual soldering, reflow, and automated soldering processes

Why Choose AIM SN63/Pb37 OAJ?

The combination of eutectic alloy and OAJ water-soluble flux ensures fast wetting, strong joints, and fully cleanable residues. Ideal for through-hole and high-density electronics assembly, PCB repair, and high-reliability manufacturing requiring water-cleaned solder joints.

Choose AIM SN63/Pb37 OAJ 2% Water-Soluble Wire Solder for precise, reliable, and clean soldering on medium- and large-scale electronic assemblies.

Unit: 1 lb. spool

Technical Data Sheet
Safety Data Sheet