AIM M8-REL61-T4 No Clean Lead Free Solder Paste , 500 Gram Jar

AIM M8-REL61 No-Clean Solder Paste is engineered for the most demanding, high-density electronic assemblies, offering exceptional performance and reliability. An evolution of the highly successful NC258 platform, M8 takes no-clean solder paste technology to the next level. Designed for T4 and finer mesh lead-free alloy powders, M8 ensures stable transfer efficiencies that meet the challenges of today’s complex applications.

The novel activator system in M8 provides powerful, durable wetting action, ensuring compatibility with a wide range of profiling processes and techniques. Designed to reduce HiP defects on BGA components and minimize voiding on QFN/BTC components, M8 delivers bright, shiny solder joints that meet the highest standards of quality and performance. The paste leaves minimal, high-purity residue, which is safe to remain in place, and can be easily coated or removed when necessary.

Formulated with AIM’s REL61™ lead-free solder alloy, this solder paste delivers superior thermal shock, vibration, and drop shock resistance compared to traditional SAC alloys. REL61’s exceptional spread, flow, and wetting characteristics outperform low-silver alloys in production testing, making it the ideal choice for applications requiring increased durability, such as LED lighting, automotive electronics, and high-power components.

SMT Supplies is your best source for AIM No-Clean solder paste. Most items ship same day.

Key Features:

• Halogen-free for safer, environmentally conscious use
• Low voiding on BGA and BTC components for reliable performance
• REACH and RoHS compliant to meet global regulatory standards
• High-density assemblies with stable transfer efficiency and reliable wetting action
• Formulated for T4 and finer mesh powders for precise application
• High SIR/Electrically safe residue for enhanced reliability
• REL61™ Lead-Free Solder Alloy with superior thermal and mechanical properties, ideal for industries demanding thermal cycling durability

AIM M8-REL61 No-Clean Solder Paste provides a low-cost alternative to SAC alloys without compromising on performance. With enhanced durability and reliability, this solder paste is the go-to solution for industries requiring long-term performance in challenging environments.

Packaging: 500-Gram Jar
Alloy Composition: REL61™ Lead-Free Alloy (Tin, Bismuth, Silver, Copper, Grain Structure Refiners)

Technical Data Sheet
Safety Data Sheet