AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.
Enter your email address to receive a promo code for 10% OFF your entire next order!
Receive special promos, tips, new product emails... and rest assured, we will never share your email address.