AIM Solder Products
AIM NC258-SAC305-T3 Lead Free No Clean Solder Paste, 500 Gram Jar
AIM NC258-SAC305-T3 Lead Free No Clean Solder Paste, 500 Gram Jar
SKU:SMT 21077
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AIM NC258-SAC305-T3 is a lead-free, no-clean solder paste formulated to provide exceptional print definition and superior wetting. Designed for high-speed stencil printing and excellent solderability across a variety of surfaces, NC258 delivers consistent performance for SMT assembly operations.
This T3 particle size paste is well-suited for standard pitch applications, offering excellent print quality, low voiding, and easy cleaning—although cleaning is typically not required due to its no-clean formulation.
Features:
- SAC305 Lead-Free Alloy (Sn96.5/Ag3.0/Cu0.5)
- T3 Particle Size for standard SMT applications
- Excellent printability and slump resistance
- Wide process window
- Outstanding wetting on various metallizations
- No-clean, low-residue flux system
- RoHS compliant
Specifications:
- Manufacturer: AIM Solder
- Alloy: SAC305 (96.5% Sn / 3.0% Ag / 0.5% Cu)
- Flux Type: NC258 (No Clean)
- Particle Size: T3
- Packaging: 500 Gram Jar
- Shelf Life: 1 year refrigerated (0–10°C)
Applications:
- Surface Mount Technology (SMT) Assembly
- Consumer Electronics
- Automotive Electronics
- Industrial Controls
- LED and Lighting
Important: Cold Shipping Required
This product ships cold to maintain material integrity. We strongly recommend selecting Next Day shipping to ensure proper handling and quality preservation during transit.
Storage & Handling:
Store refrigerated at 0°C to 10°C for optimal shelf life. Allow solder paste to reach room temperature (approximately 20°C to 25°C) before use. Do not heat paste rapidly.
Technical Documentation:
Fast Shipping | In Stock
Ships same day on orders placed before 2 PM (Pacific Time). Properly packaged for safe transport under industry standards.
Need a different particle size or flux type? Contact us for custom options or additional product recommendations.
