AIM NC258-SAC305-T3 Lead Free No Clean Solder Paste, 500 Gram Jar

AIM NC258-SAC305-T3 is a lead-free, no-clean solder paste formulated to provide exceptional print definition and superior wetting. Designed for high-speed stencil printing and excellent solderability across a variety of surfaces, NC258 delivers consistent performance for SMT assembly operations.

This T3 particle size paste is well-suited for standard pitch applications, offering excellent print quality, low voiding, and easy cleaning—although cleaning is typically not required due to its no-clean formulation.

Features:

• SAC305 Lead-Free Alloy (Sn96.5/Ag3.0/Cu0.5)
• T3 Particle Size for standard SMT applications
• Excellent printability and slump resistance
• Wide process window
• Outstanding wetting on various metallizations
• No-clean, low-residue flux system
• RoHS compliant

Specifications:

• Manufacturer: AIM Solder
• Alloy: SAC305 (96.5% Sn / 3.0% Ag / 0.5% Cu)
• Flux Type: NC258 (No Clean)
• Particle Size: T3
• Packaging: 500 Gram Jar
• Shelf Life: 1 year refrigerated (0–10°C)

Applications:

• Surface Mount Technology (SMT) Assembly
• Consumer Electronics
• Automotive Electronics
• Industrial Controls
• LED and Lighting

Important: Cold Shipping Required

This product ships cold to maintain material integrity. We strongly recommend selecting Next Day shipping to ensure proper handling and quality preservation during transit.

Storage & Handling:

Store refrigerated at 0°C to 10°C for optimal shelf life. Allow solder paste to reach room temperature (approximately 20°C to 25°C) before use. Do not heat paste rapidly.

Technical Documentation:

• TDS - AIM NC258 Solder Paste (PDF)
• SDS - AIM NC258 SAC305 (PDF)

Fast Shipping | In Stock

Ships same day on orders placed before 2 PM (Pacific Time). Properly packaged for safe transport under industry standards.

Need a different particle size or flux type? Contact us for custom options or additional product recommendations.