• AIM M8 SN63/PB37 T4 No Clean Solder Paste , 700 Gram Cartridge
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AIM Solder Products

AIM M8-SN63/PB37-T4 No Clean Solder Paste, 700 Gram Cartridge

AIM M8-SN63/PB37-T4 No Clean Solder Paste, 700 Gram Cartridge

SMT 89330

$90.00
$90.00
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AIM M8-SN63/Pb37-T4 No Clean Solder Paste – 700g Cartridge

Advanced no-clean solder paste combining proven Sn63/Pb37 alloy with AIM’s next-generation M8 flux system for superior performance in high-reliability electronics manufacturing.

AIM’s M8 No Clean Solder Paste with Sn63/Pb37 alloy is designed to meet the rigorous demands of today’s fine-pitch SMT assemblies. Engineered for exceptional print consistency, superior wetting, and reduced defects like HiP (head-in-pillow), this paste delivers maximum reliability while leaving minimal, clear, and pin-testable residues. It supports transfer efficiencies even in ultra-fine applications, making it ideal for use in aerospace, medical, automotive, and industrial electronics.

Key Features

  • Excellent Print Transfer: Superior paste release and transfer efficiency on components down to 01005 and area ratios >0.50.
  • Formulated for Fine Powders: Optimized for T4 and finer powder sizes to support tight spacing and small pads.
  • Low Voiding: Reduces voiding to <5% on BGAs and <10% on BTC components.
  • Defect Reduction: Eliminates HiP (head-in-pillow) and NWO (non-wet open) defects.
  • Minimal Residue: Transparent, LED-compliant residue is ideal for optical inspection and pin-testing.
  • High Wetting Performance: Creates smooth, shiny joints on various surface finishes.
  • Proven Reliability: Passes Bono, automotive SIR, and electrochemical testing for high-reliability applications.
  • Extended Stencil Life: Over 8 hours of stencil open time for production flexibility.
  • Available in Leaded and Lead-Free: This version uses a traditional Sn63/Pb37 alloy for applications still requiring tin-lead soldering.

Alloy Information

  • Composition: Sn63 / Pb37 (Eutectic Tin-Lead)
  • Flux Type: No Clean (M8 formulation)
  • Powder Size: T4 (20–38µm)
  • Package: 700 gram cartridge
  • Lead-Free: No (Contains lead)
  • REACH Compliant: Yes
  • RoHS Compliant: Exempt (Lead in solder for specific applications under RoHS exemptions)

Technical Documentation

Cold Shipping Required

Important: This product ships cold to maintain material integrity. We strongly recommend selecting Next Day shipping to ensure proper handling and quality preservation during transit.

Fast Shipping | In Stock

Orders placed before 2 PM (Pacific time) ship the same day. Properly cold-packed for safe transit under industry standards.

Why Choose AIM M8 with Sn63/Pb37?

This solder paste provides the stability of AIM’s advanced M8 flux chemistry with the traditional performance of a tin-lead eutectic alloy. It's trusted by professionals in defense, aerospace, medical, and other sectors requiring precision and reliability in every solder joint.

Optimize your process and reduce defects—order your AIM M8 Sn63/Pb37 solder paste today with Next Day delivery!
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