• AIM Lead Free Water Soluble Solder Paste WS488-SAC305-88.5-T4, 500 Gram Jar
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AIM Solder Products

AIM WS488-SAC305-88.5-T4 Lead Free Water Soluble Solder Paste, 500 Gram Jar

AIM WS488-SAC305-88.5-T4 Lead Free Water Soluble Solder Paste, 500 Gram Jar

SMT 21602

$109.00
$109.00
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AIM WS488-SAC305-88.5-T4 Lead-Free Water Soluble Solder Paste – 500g Jar

Water-soluble solder paste engineered for high-reliability applications requiring post-solder cleaning.

AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes.

After reflow, WS488 post-reflow residues are easily cleaned with DI water, especially under low-standoff devices. This simplifies the cleaning process and helps maintain a high level of reliability in the final assembly.

WS488 is available with T4 powder, but it is also compatible with finer powders, making it suitable for both print and dispense applications. Additionally, WS488 solder paste is readily available in SAC305 and Sn63/Pb37 alloys, with the possibility of other alloys upon request.

Product Features:

  • Water Soluble Flux: WS488 provides superior wetting and cleanability, ideal for military, aerospace, and medical electronics.
  • Lead-Free SAC305 Alloy: 96.5% Sn / 3.0% Ag / 0.5% Cu – RoHS compliant and environmentally responsible.
  • Excellent Print Performance: Stable, repeatable printing with minimal slump or bridging.
  • High Activity: Optimized formulation delivers robust soldering performance across a broad range of surface finishes, promoting reliable and consistent joint formation.
  • Fine Powder: T4 powder (20–38µm) supports fine-pitch components.
  • 8+ Hour Stencil Life: Long stencil life supports extended production runs without degradation in print quality.
  • Extended Cleaning Window: Allows for greater flexibility in post-solder cleaning processes.

Product Specifications:

  • Brand: AIM Solder
  • Alloy Composition: SAC305 (Sn96.5/Ag3.0/Cu0.5)
  • Flux Type: Water Soluble
  • IPC Classification: J-STD-004B/C ORM1
  • Flux Content: 11.5%
  • Powder Size: T4 (20–38 microns)
  • Package: 500 gram jar
  • Lead-Free: Yes
  • RoHS Compliant: Yes

Ideal For:

  • PCB assemblies requiring post-solder cleaning
  • Applications demanding high-reliability joints
  • Military, aerospace, medical, and automotive electronics
  • Automated stencil printing in SMT production

Documentation:

Cold Shipping Required

Important: This product ships cold to maintain quality and shelf life. We strongly recommend selecting Next Day shipping to ensure temperature control during delivery.

Fast Shipping | In Stock

Orders placed before 2 PM (Pacific time) ship the same day. Carefully packed with cold packs for safe transit.

Why Choose AIM?

AIM’s WS488 solder paste is trusted for its cleaning ease and exceptional performance in demanding electronic assemblies. Proven results across industries where failure is not an option.

Ensure clean, strong, and reliable solder joints – order your WS488 solder paste today with Next Day delivery for peak performance!
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