• AIM M8 REL61 T4 No Clean Lead Free Solder Paste , 600 Gram Cartridge
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AIM Solder Products

AIM M8-REL61-T4 No Clean Lead Free Solder Paste , 600 Gram Cartridge

AIM M8-REL61-T4 No Clean Lead Free Solder Paste , 600 Gram Cartridge

SMT 89493

$98.00
$98.00
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AIM M8-REL61-T4 No Clean Lead-Free Solder Paste – 600g Cartridge

Premium no-clean solder paste designed for modern high-reliability SMT applications requiring extended durability and enhanced wetting.

AIM engineered M8 No Clean Solder Paste for the most demanding applications, including automotive, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.

M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.

To guarantee the highest quality, AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.

Product Features:

  • Next-Gen Flux Technology: M8 chemistry delivers ultra-low voiding, excellent wetting, and residue that does not require cleaning.
  • REL61 Alloy: A high-reliability, lead-free alloy engineered to outperform SAC alloys with improved drop shock and thermal cycling resistance.
  • Consistent Printability: Long stencil life, excellent tack time, and repeatable paste release ensure smooth SMT production.
  • Fine Powder: T4 powder (20–38µm) supports fine-pitch components in dense PCB layouts.
  • Low-Residue Performance: Transparent and benign residues ideal for visual inspection and no-clean environments.

Product Specifications:

  • Brand: AIM Solder
  • Alloy Composition: REL61 (Sn-Ag-Cu-Bi)
  • Melting Temperature: 208°C -215°C
  • Flux Type: No Clean
  • Powder Size: T4 (20–38 microns)
  • Package: 600 gram (21.2 oz) cartridge
  • Lead-Free: Yes
  • RoHS Compliant: Yes

Ideal For:

  • Automotive, LED, aerospace, and industrial electronics
  • Applications with demanding thermal and mechanical stress requirements
  • Fine-pitch SMT assembly with no-clean processes
  • Environments requiring low voiding and high-reliability interconnects

Documentation:

Cold Shipping Required

Important: This solder paste must ship cold to preserve its integrity and performance. Next Day shipping is strongly recommended to maintain the cold chain throughout transit.

Fast Shipping | In Stock

Orders placed before 2 PM (Pacific time) ship the same day. Cold-packed with thermal protection to ensure compliance with storage guidelines.

Why Choose AIM M8 with REL61?

The M8-REL61 solder paste combines AIM’s industry-leading M8 flux with a high-reliability REL61 alloy for unmatched drop-shock resistance, low voiding, and extended operational life. Ideal for next-gen, mission-critical electronics manufacturing.

Protect your materials — order now with Next Day shipping for optimal handling and reliability!
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