Soder-Wick No Clean desoldering wick is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean desoldering wick uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. 

Soder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

Features & Benefits:

• Patented noncorrosive, halide free, organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance

Specifications:

• MIL-F-14256 F
• NASA-STD-8739.3 Soldered Electrical Connections
• DOD-STD-883E, Method 2022
• ANSI/IPC J STD-004, Type ROL0
• Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
• Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit

Technical Data Sheet

SDS