Are you looking to eliminate voids?
New AIM V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
Please review our Solder Paste Shipping Recommendations before you place your order.
Enter your email address to receive a promo code for 10% OFF your entire next order!
Receive special promos, tips, new product emails... and rest assured, we will never share your email address.