Regular price
$84.00
Shipping calculated at checkout.
AIM NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed.
This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.
Features:
|
- Broad Printing Process Window |
- Low-Tombstoning |
- No Head-in-Pillow |
|
- Clear Pin–Probe Testable Residue |
- 24 Hour Stencil Life |
- Excellent Wetting |
|
- Reduces Voiding Under Micro-BGAs |
- 12-14 Hour Tack Time |
- Low Solder Beading |
Please review our Solder Paste Shipping Recommendations before you place your order.
Technical Data Sheet