AIM RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes. Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated through holes or surface mount interconnections. RX18 specialized packaging ensures consistent, accurate, jam-free wire feeding. RX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements and do not require cleaning

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant.

• Liquidus 220°C (428°F)
• Compatible with all Flux Types
• Excellent Wetting Speed
• Excellent Solderability and Spreading
• Reduced Bridging Versus Sn-Cu Alloys
• Complies with IPC J-STD-006

Technical Data Sheet
Safety Date Sheet

SAC305 Alloy