BEST CHOICE FOR HIGH RELIABILITY SOLDERING APPLICATIONS
REL61™LEAD-FREE SOLDER ALLOY, developed by AIM, is comprised of tin, bismuth, silver, copper and elemental grain structure refiners. Extensive testing indicates REL61 can reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance. REL61 exhibits superior spread, flow and wetting when compared to low silver alloys in production testing. REL61 is ideally suited for industries which require increased durability in thermal cycling performance such as LED lighting, in-cabin automotive electronics and high power applications. REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys.
REL61™ is ideally suited for industries which require increased durability in thermal cycling performance such as LED lighting, in-cabin automotive electronics and high power applications. REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys.
REL61 AT A GLANCE
Enter your email address to receive a promo code for 10% OFF your entire next order!
Receive special promos, tips, new product emails... and rest assured, we will never share your email address.